Work Packages

TURANDOT’s work is organised into eight interconnected work packages, spanning requirements and architecture through hardware, software, integration, demonstration and exploitation.

WP1Requirements, Architecture & Automotive-Specific Features

Lead: STMicroelectronics Italy (ST-IT)

Defines the functional, performance and architectural requirements for high-performance RISC-V automotive processors, ensuring compliance with safety, security and real-time constraints, and establishes the automotive reference architecture and its hardware, software and system-level interfaces.

WP2Supply Chain Infrastructure & EDA Tools

Lead: Arteris (ART)

Ensures supply-chain and infrastructure readiness for automotive RISC-V chips: EDA tools and methodologies that capture and track functional-safety requirements from early design to physical implementation, based on configurable IP-XACT 2022 metamodels.

WP3High-Performance RISC-V Automotive Processors, Accelerators & other IPs

Lead: Axelera AI (AXE-NL)

Designs, prototypes and validates RISC-V processing and acceleration IP blocks – real-time and application CPUs, AI accelerators and supporting system IPs – for real-time, safety-critical and AI-intensive automotive workloads, in line with ISO 26262.

WP4Software Stack for Automotive Applications

Lead: ZF Friedrichshafen (ZFAG)

Develops, integrates and documents qualifiable safety and security SDKs for the TURANDOT processors and accelerators – runtime software, design tools and application porting – using virtual platforms to decouple software from hardware timelines.

WP5System Integration & Interoperability

Lead: Robert Bosch (BOSCH-DE)

Defines the TURANDOT automotive RISC-V reference architecture and designs and implements the TURANDOT chip and FPGA designs at system, RTL and physical level – the foundation for the demonstrators.

WP6Demonstrators, Benchmarking and Validation

Lead: Infineon Technologies (IFAG)

Validates the TURANDOT hardware and software building blocks in demonstrators aligned with real automotive use cases, showing interoperability, safety, performance and scalability, and gathering feedback from OEMs and Tier-1s.

WP7Common Automotive Repository

Lead: Quintauris (QUINT)

Establishes the common repository of IP blocks, software tools and documentation, an automotive-grade RISC-V reference platform, clear rules for open, shareable and confidential IP, and standardised benchmarking and integration guidelines.

WP8Project Management, Dissemination, Communication & Exploitation

Lead: NXP Semiconductors Germany (NXP-DE)

Coordinates the project and manages risks, quality, IPR and data; communicates and disseminates results; drives exploitation and standardisation, liaison with other initiatives and the European RISC-V collaborative business model.

Milestones

IDMilestoneWork packagesMonth
MS1Kick-off meeting; launch of the website and LinkedIn channelAllM1
MS2Initial requirements collected and transferredWP1M10
MS3First Technology Advisory Board meetingAllM12
MS4TURANDOT automotive RISC-V architecture specification defined; repository architecture finalisedWP5, WP7M12
MS5Real-time processor architecture specs complete; AI accelerators, SW and tool architecture definedWP3, WP4M16
MS6Delivery of initial IP-XACT 2022 metamodelsWP2M18
MS7Intermediate requirements collected; runtime SW architecture for RISC-V definedWP1, WP4M24
MS8Application processors & accelerators RTL completeWP3M24
MS9Demonstrator platforms & evaluation procedure defined for all demonstratorsWP6M24
MS10Benchmarking framework operational & data ingestion pipeline functionalWP7M24
MS11FPGA prototypes validation completeWP3M30
MS12First silicon tape-out package (Demonstrators 1, 2 and 3)WP3, WP5M30
MS13Foundations of the “Airbus of RISC-V” and assessment of partners’ exploitation plansWP8M30
MS14SDV integration architecture definedWP4M32
MS15Final requirements collected; integration & validation framework operationalWP1, WP2M36
MS16Second silicon tape-out package (Demonstrators 1, 4 and 6)WP3, WP5M36
MS17All demonstrators fully specified; first phase of physical and virtual demonstrators realisedWP6M36
MS18Interface and integration guidelines for chiplet compatibility definedWP5M36
MS19Third silicon tape-out package (Demonstrators 2 and 5)WP3, WP5M40
MS20Architecture for automotive ADAS/infotainment workloads definedWP4M40
MS21Advanced-node silicon & safety validationWP3M42
MS22Use-case mapping finalisedWP7M42
MS23Certification-ready design flow availableWP2M48
MS24Complete IP portfolio integration packageWP3M48
MS25Chips & demonstrator validations completeWP6M48
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